India Starts 3D Chip Packaging Unit in Odisha

The foundation stone for India's first advanced 3D chip packaging unit has been laid in Bhubaneswar, Odisha, marking a significant milestone for the nation’s semiconductor ecosystem. This project, backed by an investment of ₹2,000 crore, aims to utilize advanced 3D glass substrate technology, revolutionizing chip manufacturing in India. Union Minister for Electronics & IT Ashwini Vaishnaw emphasized the importance of this initiative, noting the contributions of industry leaders like Intel and Applied Materials. The facility is set to produce 70,000 glass panels and 50 million assembled units annually, significantly enhancing India's capacity in advanced electronics manufacturing.

Strategically, this development aligns with India's vision of Atmanirbhar Bharat, which aims to reduce dependency on foreign technology. By establishing this plant, India strengthens its position in the semiconductor sector, fostering local expertise and job creation—more than 2,500 jobs are anticipated. Furthermore, the establishment of this facility alongside India's first compound semiconductor fabrication unit in Odisha enhances the state’s industrial landscape, supporting national AI strategies with vital infrastructure.