NTT Supports Rapidus with Liquid-Cooled GPU Deployment

NTT Docomo Business has announced a strategic partnership with Rapidus to deploy liquid-cooled GPU server capacity in Japan. This deployment, which leverages the Green Nexcenter design, is integral to supporting Rapidus's efforts in AI and semiconductor manufacturing. The initiative is part of a broader strategy to establish Hokkaido as a semiconductor manufacturing hub, addressing the limitations of air cooling in high-performance computing (HPC) tasks critical for chip design.

This collaboration between NTT and Rapidus reflects a significant shift in Japan's approach to semiconductor production, particularly as the country aims to manufacture sub-2nm chips by 2027. By utilizing advanced cooling technologies, NTT facilitates the necessary computational power for semiconductor innovations while emphasizing reduced environmental impact. This development not only fortifies Japan's domestic semiconductor capabilities but also promotes AI infrastructure independence, lessening the need for foreign technology reliance.