TSMC Rejects €350M ASML Lithography Tool Purchase

At the North America Technology Symposium, TSMC’s Co-Chief Operating Officer, Zhang Xiaoqiang, announced that the company will not be acquiring ASML’s latest High-NA EUV lithography equipment due to its price exceeding €350 million per unit. While this advanced tool promises enhanced chip manufacturing precision under 1.4nm, TSMC has deemed the investment unfeasible at this time.

The decision reflects broader trends in semiconductor manufacturing, where high costs can hinder technological advancements. Not purchasing this equipment may limit TSMC’s ability to remain competitive as demand for ultrafine chips rises, while potentially increasing reliance on existing manufacturing tools, thus impacting domestic manufacturing capabilities.